MediaTek’s First chipset using 2nm technology expected in late 2026
MediaTek today announced a major industry milestone, becoming one of the first companies to partner with TSMC (TWSE: 2330, NYSE: TSM) on its enhanced N2P process technology. The company has successfully taped out its flagship system-on-chip (SoC) powered by N2P, with mass production expected to begin in late 2026.
This marks the latest breakthrough in MediaTek and TSMC’s long-standing partnership, which continues to deliver high-performance, power-efficient chipsets across flagship mobile devices, computing, automotive, and data center applications.
TSMC’s N2 family is its first to adopt nanosheet transistor architecture, with N2P as the next evolution in the roadmap. Compared with the current-generation N3E process, N2P delivers:
- Up to 18% performance boost at the same power.
- Around 36% power reduction at the same speed.
- 1.2x increase in logic density.
“MediaTek’s innovations powered by TSMC’s 2nm technology underscore our leadership in bringing the most advanced process technologies to market,” said Joe Chen, President of MediaTek. “Our close collaboration with TSMC has enabled us to deliver solutions with exceptional performance and energy efficiency, meeting the needs of customers from the edge to the cloud.”
Dr. Kevin Zhang, Senior Vice President of Business Development and Global Sales and Deputy Co-COO of TSMC, added: “N2P represents a pivotal step in the nanosheet era, reflecting our commitment to tuning and refining process technologies to deliver energy-efficient computing. Our collaboration with MediaTek ensures that enhanced performance and power benefits will be maximized across a wide range of applications.”
With N2P, MediaTek and TSMC are setting the stage for the next wave of semiconductor innovation, powering smarter, faster, and more energy-efficient devices for the future.
